Production:
- Actual capacity of SMT components placement rate of up to 150,000 components per hour.
- Assembly of special components 0201, Micro BGA, Micro QFN, Fine pitch, Odd shapes.
- Rework of BGA and QFN components, low and high quantity.
- X-RAY inspection of special components, three-dimensional analysis of the image, non destructive testing and failure analysis.
- Electrical tests.
- ICT tests.
- AOI testing.
- Wave soldering of components non ROHS and ROHS.
- Adherence of components, Acrylic coatings of mounted PCB according to military standards.
Purchasing and Logistics:
- Full ERP management system.
- Project management and MRP (Material Requirement Planning) According to orders and marketing forecast.
- Management of engineering BOM.
- Management of ECO (Engineering Change Orders).
- Management of versions and serial numbers traceability.
- Managing customer storage facilities.
Engineering:
- Designing products for mass production
- Tracking and locating alternative components.
- Define and manage customer BOM.
- Planning for mass production.
- Designing and making Production files.
- Adjusting production processes to customer requirements.
